Appendix

Laboratory Process Guide 2023

APPENDIX

Solderability SEM / EDS

Solderability SEM / EDS testing is conducted on BGA products only. These parts are unable to go through the Gen3 MUST3 machine due to the nature of the terminations.

These terminations are very small balls of solder that, when heated, will melt and fall from the underside of the component which makes it impossible for a Wetting Balance test or Dip & Look testing to be undertaken.

In the top right is a 1000x magnification image of a solder sphere. Here, the Technician is looking for serious contamination or damage.

The bottom right is a spectrum analysis of the

elements present on the surface of that sphere. This works in the same way as the XRF testing in showing us what elements are there based on the energy value they return when an X-Ray beam contacts them.

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