TERM

Mask

mN

Nitric Acid

NMP

Package type

Part

Pin-out

PMP

DESCRIPTION

A marking commonly found on Silicon dies, a ‘M’ with a circle around it

milli-Newtons, measurement of Force on an object

Chemical used for Decapsulation of metal devices

1-Methyl-2-Pyrolidinone, chemical used in re-surfacing test

The form in which the part is made, i.e. the shape, size and termination type. All listed package types other than QFN are deemed leaded. See below for common package types.

BGA – Ball Grid Array (Variations include FBGA, LBGA, LFBGA)

DIP – Dual In-line Package (CDIP = Ceramic, PDIP = Plastic)

PGA – Pin Grid Array

QFP – Quad Flat Pack (variations include CQFP, PQFP, TQFP)

QFN – Quad Flat No-leads

SOP – Small Outline Package (Variations inclue TSSOP, SOIC, SOT)

Also called Component, Device, Sample

Manufacturer’s information regarding the purposes for each termination and how the internal connections should be observed on X-Ray inspection

Chemical solution used in re-surfacing tests. PMP stands for Part Marking Permanency