DESCRIPTION

Restriction of Hazardous Substances, a directive restricting the use of elements such as Lead, Mercury, Cadmium and Bromine in electrical and electronic components.

Scanning Electron Microscopy

Form of Silicon on a microscopic level. Silicon appears as spheres on the top surface of parts.

Rectangular piece of Silicon present within Active devices that are the brains of the part. Retrieved from acid or ash after Decapsulation

Small metal ball(s) present on the underside of BGA devices

Chemical used for Decapsulation of epoxy devices

Area of component that will be attached to a circuit board using solder

See below for termination finishes.

Sn – Tin

SnPb – Tin / Lead

SnAgCu - Tin / Silver / Copper

NiPdAu - Nickel / Palladium / Gold

AuNi - Gold / Nickel

Consistent scratches following the same direction across the surface of the component

When solder ‘wets’ the termination, adheres to.

TERM

RoHS/Non-RoHS

SEM

Silicon sphere(s)

Silicon die

Solder sphere(s)

Sulfuric Acid

Termination

Unidirectional abrasions

Wetting