Solderability Testing

Laboratory Process Guide 2023

SOLDERABILITY TESTING

Solderability

SEM/EDS

Equipment: Hitachi TM4000+ or TM3000

Destructive?: No

Duration: PR9 20 mins – AS6081 1hr

Description: For BGA package types. In this test, the component is placed inside the SEM and a single solder sphere is targeted with a high-powered beam that scans the surface for elemental composition.

Less than 3% Oxygen presence is an

indication of good quality terminations. If over

3% Oxygen is observed, a recommendation

to use stronger flux is given.

The SEM must be used for BGA devices due to the nature of the terminations. Solder spheres will melt and fall from the device if contacted by the molten solder used in Gen3 testing.

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