Solderability Testing

Laboratory Process Guide 2023

SOLDERABILITY TESTING

Solderability Wetting Balance

Equipment:

Gen3 MUST3 Solderability Machine

Destructive?: Yes

Duration: PR9 10 mins – AS6081 30 mins

Description: For leaded package types e.g. QFPs, SOIC, SOT.

In this test the component is placed in a clamp and then suspended above molten solder. It is then lowered until it meets the solder. As the solder adheres to the termination, a graph will be produced showing how much force (mN) was required before ‘Wetting’ occurred.

This test is conducted to ensure that when

the devices reach production there will not

be any issues soldering them to the board.

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