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Contents
Laboratory Process Guide 2023
CONTENTS
About ACAP
Welcome
Introduction
Initial Testing
Appendix
Glossary
Radiological Inspection (X-Ray)
XRF – Analysis of termination finish
Solderability Testing
Solderability Wetting Balance
Solderability Dip & Look
Solderability SEM/EDS
Re-surfacing Testing
NMP (N-Methyl-2-pyrrolidinone)
Dynasolve 750 or 760 (HTC)
Scanning Electron Microscopy & Energy Dispersive Spectrometry (SEM/EDS)
Decapsulation & Die Verification
Decapsulation (Chemical)
Decapsulation (Ash Oven)
Die Verification
02
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